WAFER SUPPORTING DEVICE AND MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR-PROCESSING APPARATUS

摘要

PURPOSE: A wafer support device, a manufacturing method thereof, and a semiconductor processing apparatus are provided to improve the uniformity of a film property and a film thickness by reducing the number of particles attached to the rear of a wafer in a film forming process. CONSTITUTION: A protrusion part is arranged on a diameter line(2A-2A) on a base surface and is uniformly arranged on the region of the base surface. A first protrusion part(11) is composed of ceramic balls buried in the base surface. The ceramic ball is buried in the base surface by caulking. A second protrusion part is made of the same materials as the materials of the base surface.