Recessed Wire Bonded Semiconductor Package Substrate

摘要

A semiconductor package substrate (320) including a plurality of dielectric layers (424) and a plurality of metal layers (422), wherein the metal layers (422) further include a first metal layer (440) and at least one underlying metal layer (442), and wherein the underlying metal layer (442) is configured for a di rect interconnection with a semiconductor die (410). Preferably, the top metal layer (440) includes a ground plane. An underlying metal layer (442) comprises the signal layer, which is preferably bonded to the die by a plurality of bond wires (452).