| 摘要 |
<p>PURPOSE: A semiconductor fabricating apparatus and a method for driving the same, and a method for fabricating a magnetic tunnel junction using the same are provided to reduce the area of the magnetic tunnel junction by using a sputtering process. CONSTITUTION: A supporting part(214) includes a wafer. A first control unit generates a first control signal for activation in a first period. A first sputtering part(212) continuously sputters a metal target on the wafer. A second control unit generates a second control signal for activation in the first period. A second sputtering part(213) repetitively sputters a magnetic target on the wafer. [Reference numerals] (221,222) First sputtering control part</p> |
