| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a thermal stress imposed on the surface of a semiconductor chip in a ball grid array semiconductor package so as to prevent the circuit element of the semiconductor chip from malfunctioning. <P>SOLUTION: The semiconductor chip 13 is mounted on the one surface of a board 11, a dummy chip 16 formed of a semiconductor wafer whose coefficient of thermal expansion is approximate to that of the semiconductor chip 13 is superposed on the semiconductor chip 13, and a metal plate 18 having a coefficient of thermal expansion approximate to the one possessed by the board 11 is provided on the dummy chip 16. The one surface of the board 11 is sealed up together with the semiconductor chip 13 and the dummy chip 16 with a molding resin layer 20, and the metal plate 18 is embedded in the molding resin layer 20 so as to expose its one surface to the outside. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
