| 摘要 |
PURPOSE: A semiconductor package is provided to suppress the bending of the package regardless of the thickness of a circuit board by using a sealing layer and a thin film layer by a thermal curing process. CONSTITUTION: A semiconductor device(5) is formed on a circuit board layer(4). A sealing layer(3) covers the semiconductor device. The modulus of elasticity of the sealing layer is 0.1 to 1 Gpa. A thin film layer(2) is formed on the sealing layer. The modulus of elasticity of the thin film layer is 5 to 25 GPa.
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