SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to adjust the width of a bottom electrode by using first and second support layer patterns and to prevent a bridge phenomenon. CONSTITUTION: Multiple bottom electrodes(170) are arranged on a substrate. A first support layer pattern(130) contacts the lower part of the bottom electrodes. The second support layer pattern(150) contacts the upper part of the bottom electrodes. A dielectric layer is formed on the bottom electrodes. The upper electrode is formed on the dielectric layer. [Reference numerals] (AA) Third direction; (BB) First direction; (CC) Second direction