| 摘要 |
PURPOSE: An etchant composition of a copper film and a titanium film is provided to uniformly etch a multi-metal film composed of the copper film and the titanium film at a rapid etching speed, thereby obtaining excellent etching properties. CONSTITUTION: An etchant composition of a copper film and a titanium film comprises 5-20wt% of persulfate, 0.01-2wt% of a fluorocompound, 0.001-3wt% of a chloridecompound, a mineral acid, salts thereof or 1-10wt% of a compound thereof, 0.3-5wt% of a ring-type aminocompound, an organic acid, salts thereof or 1-10wt% of a compound thereof, 0.1-5wt% of a P-toluenesulfonic acid, and remained water. |
