发明名称 |
Integrated liquid cooling system |
摘要 |
A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.
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申请公布号 |
US8358505(B2) |
申请公布日期 |
2013.01.22 |
申请号 |
US20100914190 |
申请日期 |
2010.10.28 |
申请人 |
ASETEK A/S;TOFTLOEKKE MIKKEL BLOCK;RATLIFF CHRISTOPHER;LYKKE PETER;BERK TODD;ERIKSEN ANDRE SLOTH |
发明人 |
TOFTLOEKKE MIKKEL BLOCK;RATLIFF CHRISTOPHER;LYKKE PETER;BERK TODD;ERIKSEN ANDRE SLOTH |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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