FABRICATION METHOD OF EMITTER WRAP THROUGH SOLAR CELL USING SELECTIVE PUNCH THROUGH

摘要

PURPOSE: A method for manufacturing a rear electrode solar cell using a selective punch through is provided to reduce manufacturing costs by reducing expensive noble metal. CONSTITUTION: A via hole is formed by using laser. N type impurities are doped on a semiconductor substrate(100). An antireflection layer(200) is formed on one side of the semiconductor substrate. A passivation layer(300) is formed on an opposite side to one side of the semiconductor substrate. A first electrode material passes through the passivation layer.