| 摘要 |
A chip card module including a substrate with a first side and an opposite second side. Contact areas are arranged on the first side, and a first conductor structure is arranged on the second side, the first conductor structure runs from one contact region to one of a another contact region and a second conductor structure, which is connected to the contact areas by means of a through connection in the substrate, so that the first conductor structure runs at least partly in a central region. The chip card module also includes a chip with connections which are arranged over the central region on the second side of the substrate, one of the connections being connected to the one contact region.
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