| 发明名称 |
Acidic gold alloy plating solution |
| 摘要 |
A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
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| 申请公布号 |
US8357285(B2) |
申请公布日期 |
2013.01.22 |
| 申请号 |
US20080156839 |
申请日期 |
2008.06.05 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC;MORII YUTAKA;ORIHASHI MASANORI |
发明人 |
MORII YUTAKA;ORIHASHI MASANORI |
| 分类号 |
C23C18/40;C23C28/00;C25D3/56;C25D3/62;C25D5/10;C25D5/12 |
主分类号 |
C23C18/40 |
| 代理机构 |
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