| 发明名称 |
Semiconductor device packages, redistribution structures, and manufacturing methods thereof |
| 摘要 |
Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof.
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| 申请公布号 |
US8358001(B2) |
申请公布日期 |
2013.01.22 |
| 申请号 |
US20090649265 |
申请日期 |
2009.12.29 |
| 申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC.;YANG HUNG-JEN;HSIEH CHUEHAN;HUANG MIN-LUNG |
发明人 |
YANG HUNG-JEN;HSIEH CHUEHAN;HUANG MIN-LUNG |
| 分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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