| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component that is low-priced, easy to process, and realizes a good manufacturing yield, particularly an interposer substrate having a decoupling capacitor. <P>SOLUTION: In the electronic component, a substrate 10 comprises at least capacitors 20 that are disposed on at least one main surface of the substrate and are capable of being connected to a semiconductor device; an insulator 11 that comprises a glass ceramic having a ceramic aggregate and a glass material; and a via electrode 12 that is formed in the insulator and exposed to both main surfaces of the substrate. It is preferable that the capacitor, in particular, is manufactured by a thin film process, and that the substrate is a multilayer substrate wired therein. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
