METHOD FOR MANUFACTURING CARRIER MEMBER AND METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A method for manufacturing a carrier member, and a printed circuit board manufacturing method using the same are provided to prevent a release layer form being separated caused by external shock as the release layer is not exposed to the outside. CONSTITUTION: An insulating material(101) is prepared. A second metal layer(103b) is formed on a first metal layer(103a). The first metal layer is in contact with the surface of the insulating material. The metal layers are laminated on the upper or lower surface of the insulating material. The outer edge of the second metal layer is removed. The outer edge of the first metal layer is removed.