| 摘要 |
Provided is a light emitting device package. The light emitting device package comprises a substrate, a light emitting device on the substrate, a first heatsink between the substrate and the light emitting device, the first heatsink being at least partially disposed within the substrate to transfer heat generated from the light emitting device, first and second electrodes electrically separated from each other, the first and second electrodes being electrically connected to the light emitting device.
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