Polishing pad and method of manufacture

摘要

The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.