| 摘要 |
Provided is a flexible multilayer thin film capacitor using a flexible metal substrate, including: a metal substrate; a metal oxide layer formed on the whole surface of the metal substrate; a plurality of first internal electrode layers selectively applied on a first surface of the metal substrate using a metal material; a plurality of dielectric layers formed to be sequentially multi-layered on the whole surface of the first internal electrode layers using a dielectric material; a plurality of second internal electrode layers selectively applied on the dielectric layers using a metal material; a protecting layer applied on a surface of one of the plurality of second internal electrode layers; and a single pair of external electrodes connected to contact with the plurality of first internal electrode layers and the plurality of second internal electrode layers, respectively, and soldered on conductive inter-layer pads of a printed circuit board. |
