| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor wafer at the time of conveyance from being damaged by housing plural number of sheets of the semiconductor wafers within a cassette for the semiconductor wafer. SOLUTION: The casette for the semiconductor is provided with a plurality of barriers (7) and in which a housing (8) having a designated height is formed between side walls (2, 3) and arranged between a bottom wall (4) and top wall (5); a movable shelf (9) which is movably arranged toward the bottom wall (4) or the top wall (5), and supports a semiconductor wafer (10) housed within each housing room (8); and an interconnection member (14) which is movably arranged in external surfaces of the side walls (2, 3), and connected to the movable shelf (9). The movable shelf (9) includes a concave portion (12) into which a palette (13a) of conveyance arm (13) supporting the semiconductor wafer (10) is inserted. Furthermore, the semiconductor wafer (10) is prevented from being freely moved within the housing (8), in such a way that both the semiconductor wafer (10) and the movable shelf (9) are moved at a time toward the bottom wall (4) or the top wall (5) by moving the interconnection member (14), and that the semiconductor wafer (10) is sandwiched between the barriers (7) or between the barriers (7) and the bottom wall (4) or the top wall (5). COPYRIGHT: (C)2007,JPO&INPIT |
