| 摘要 |
PROBLEM TO BE SOLVED: To transfer semiconductor wafers, or the like, while containing each of the wafers independently in a container in safety by enhancing sealing performance and shock resistance. SOLUTION: The thin plate container 11 consists of a tray containing body 12 stacking a plurality of mutually removable mounting trays 16 and containing semiconductor wafers W while respectively holding in the gaps between respective mounting trays 16, and an external container 13 for containing the tray containing body 12. At the opposite side ends of each mounting tray 16, a pair of grip portions 20 to which the processing arm of an external machine is fitted are provided. An external container 13 comprises a container body 31, a lid 32, a seal material 33 provided between the lid 32 and the container body 31 in order to seal the interior, a pair of tray container supporting portions 34 for supporting the tray containing body 12, and a tray containing body retainer 35 for supporting the tray containing body 12 contained in the container body 31 while holding from the bottom face side and the lid side. COPYRIGHT: (C)2007,JPO&INPIT |
