| 摘要 |
PURPOSE: A method for manufacturing a flexible electronic device and a method for manufacturing a flexible memory device are provided to reduce manufacturing costs by welding a bottom plate and a top coating layer at the top and bottom of a device through one high temperature process. CONSTITUTION: An electronic material layer of an electronic device is formed on a sacrificial substrate. The electronic material layer of the electronic device is transferred on an LCP(Liquid Crystal Polymer) substrate(210). The electronic device is formed on the electronic material layer. The electronic device is a memory device. An LCP coating layer(320) is formed on the electronic device. The LCP substrate and the LCP coating layer are heat-treated. A melting point of the LCP substrate is higher than a melting point of the LCP coating layer. Pressure is added between the LCP substrate and the LCP coating layer. |
