摘要 |
IT IS AN OBJECT OF THE PRESENT INVENTION TO PROVIDE A COPPER-BASED BONDING WIRE WHOSE MATERIAL COST IS LOW, HAVING EXCELLENT BALL BONDABILITY, RELIABILITY IN A HEAT CYCLE TEST OR REFLEW TEST, AND STORAGE LIFE, ENABLING AN APPLICATION TO THINNING OF A WIRE USED FOR FINE PITCH CONNECTION. THE BONDING WIRE INCLUDES A CORE MATERIAL HAVING COPPER AS A MAIN COMPONENT AND AN OUTER LAYER WHICH IS PROVIDED ON THE CORE MATERIAL AND CONTAINS A METAL M AND COPPER, IN WHICH THE METAL M DIFFERS FROM THE CORE MATERIAL IN ONE OR BOTH OF COMPONENTS AND COMPOSITION. THE OUTER LAYER IS 0.021 TO 0.12?M IN THICKNESS. |