SENSOR PACKAGE AND METHOD FOR PRODUCTING OF THE SAME

摘要

PURPOSE: A sensor package and a manufacturing method thereof are provided to simplify manufacturing method by attaching an alien inflow preventing material to the top surface of inner side of the can type cover of monolayer. CONSTITUTION: An acoustic hole(122) applying an acoustic signal from outside to inside arranges in the front side of a cover(120). An alien inflow preventing material(130) is attached to an inner side of the cover. The alien inflow preventing material prevents an inflow of alien materials from the acoustic hole. A MEMS microphone(100) comprises a substrate(110), a MEMS transducer(140), a semiconductor circuitry element(150), and an alien inflow preventing material. The substrate is formed with a semiconductor substrate and a ceramic substrate, etc.