| 摘要 |
PURPOSE: Electroless silver plating solution including hydrazine, an electroless plating method using the same, and a silver coating layer prepared by the same are provided to effectively improve the specific resistance of a coating layer for semiconductor wiring by using silver, metal having low specific resistance. CONSTITUTION: Electroless silver plating solution comprises silver nitrate as metallic salt, hydrazine as reductant, and ammonia solution as complexing agent. The plating solution also includes one of ethylenediamine and ethylenediaminetetraacetic acid(EDTA) as complexing agent. In the plating solution, the concentration of silver nitrate is 0.5-5 g/l, hydrazine 0.1-10 ml/l, ammonia solution 50-400 ml/l, and ethylenediamine or ethylenediaminetetraacetic acid 1.0-10 g/l. |
