| 摘要 |
A system for coating large area substrates with generally uniform properties comprising:
a deposition chamber in which a substrate is positioned, the chamber being maintained at subatmospheric pressure;
two or more ETP sources associated with the deposition chamber, each ETP source inducing an anode, the ETP source producing a plasma jet having a central axis; and
at least one injector that injects vaporized reagents into the plasma to form a coating that is deposited on the substrate, the injection of the reagents being located within a specified distance from the anode of the ETP source; and
wherein the vaporized reagents are injected through injector orifices located within a radius of about 0.1 to 4 inches from the orifice of the ETP source. |
