SYSTEM AND METHOD FOR SINGULATION OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A singulation system and a singulation method of a semiconductor package are provided to smoothly process products between a sawing process and a laser marking process and to prevent the generation of bad products. CONSTITUTION: A loading device loads a strip to a sawing table. A sawing unit(40) cuts the strip loaded in the sawing table into individual packages. A transfer device(60) transfers the individual packages to a laser marking table. A laser marking unit(70) marks the surface of the individual packages by using laser.