| 摘要 |
FIELD: instrument making.SUBSTANCE: device to remove heat from electronic components includes radiator plates fixed to each other, connected to a base and forming a heat-distribution surface, at the same time along perimetre of each radiator plate, in areas of their contact with the base and to create flows removing heat from the device there are bends, on the bends of the inner side of each plate there are windows made, and on trapezoidal bends perpendicular to the longitudinal axis of the device, there are lock joints made, comprising two elements, one in the form of a hole on the bend, the other in the form of a ledge on the same bend arranged opposite to the hole, at the same time the device is equipped with an outer shell connected in a contact manner with the ledge arranged on the outer side of each plate. Windows arranged on bends are made equal to 0.4-0.9 of bend height along height. For even distribution of heat flows in the body of each radiator plate there are holes.EFFECT: development of a radiator for an electronic component, where all heat absorbing parts of radiator plate and base surfaces are used, providing for efficient heat removal.7 cl, 4 dwg |
