THERMOSETTING RESIN COMPOSITION FOR CHARGING SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor encapsulation charge thermosetting resin composition and a semiconductor device are provided to seal and fill the semiconductor under good connecting state. CONSTITUTION: A semiconductor encapsulation charge thermosetting resin composition comprises a curing agent, a flux agent, and inorganic filler. The inorganic filler comprises an inorganic filler in which the average particle diameter is 100 nano meters or less and the inorganic filler in which average particle diameter is 100 nano meters or greater. The mixing amount of the inorganic filler in which the average particle diameter is 100 nano meters or less is 45 weight% or greater of the inorganic filler. A semiconductor(10) is manufactured by using the resin composition.