| 摘要 |
<p>PURPOSE: A light emitting device module and a lighting system including the same are provided to efficiently discharge heat from a light emitting device package by forming a line type through hole on a circuit board. CONSTITUTION: An insulation layer(220) is formed on a base layer(210). A conductive layer(230) is formed on the insulation layer. A bonding layer(240) is formed on the conductive layer. The bonding layer contacts a lead frame of a light emitting device package(100) with the conductive layer. A through hole passes through the insulation layer, the conductive layer, and the bonding layer from the base layer.</p> |
