| 摘要 |
PURPOSE: A method for manufacturing a semiconductor device is provided to reduce the fluctuation of the area of wide width parts by containing the wide width parts fitted between narrow width parts. CONSTITUTION: In a process for connecting a flip chip, soldering materials attached in the front end of a protruded electrode(4) and soldering materials coated on terminals(bonding lead)(11) are electrically connected by heating. Each terminal comprises a wide width part(First part)(11w) having a first width(W1) and a narrow width part(Second part)(11n). If the soldering materials are heated, the thickness of the soldering materials arranged on the narrow width parts becomes thinner than the thickness of the soldering materials arranged on the wide width parts. In the process for connecting the flip chip, the protruded electrode is arranged on the narrow width parts to connect a flip chip on the narrow width parts. [Reference numerals] (11) Terminal(Bonding lead); (11n) Narrow width part(Second part); (11w) Wide width part(First part); (4) Protruded electrode; (W1,W2) Width |
