SEMICONDUCTOR APPARATUS AND STACKED SEMICONDUCTOR APPARATUS

摘要

PURPOSE: A semiconductor device and a stack semiconductor device are provided to improve productivity by stopping an unnecessary process. CONSTITUTION: A TSV(through silicon via)(301) is electrically connected to a chip. A TSV test unit(302) checks a capacitance element of the TSV and generates an abnormal signal using the checked element. A charging node is electrically connected to the TSV. A charging node supply unit includes the charging node. [Reference numerals] (302,302-1) TSV test unit; (303) Output unit