| 摘要 |
PURPOSE: An electrostatic chuck, a substrate processing apparatus including the same, and a substrate processing method are provided to stably chuck a substrate by improving electrostatic force between the substrate and electrodes. CONSTITUTION: An electrostatic chuck is located in a process chamber and includes a dielectric plate(210), a first bottom electrode(221), a second bottom electrode(222), and a support plate. The dielectric plate is located on the upper side of the electrostatic chuck. The first bottom electrode is buried in the inner center region of the dielectric plate. The second bottom electrode is buried in the inner edge of the dielectric plate. The second bottom electrode surrounds the first electrode.
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