发明名称 IMAGE PROCESSING MODULE AND LED CHIP BONDING APPARATUS USING THEREOF
摘要 PURPOSE: An image processing module and an LED chip bonding device using the same are provided to improve the recognition rate of an LED chip by providing red light or blue light to an LED chip instead of white light. CONSTITUTION: A camera module is arranged on the upper side of a barrel(10). The camera module photographs an object arranged on the lower side of the barrel. A light source case is arranged on the outer side of the barrel. A red light generating unit(40) provides red light to the object. A blue light generating unit(50) provides blue light to the object.
申请公布号 KR20130006895(A) 申请公布日期 2013.01.18
申请号 KR20110061970 申请日期 2011.06.24
申请人 SFE CO., LTD. 发明人 HWANG, YOON JU
分类号 H01L21/58;H01L33/48 主分类号 H01L21/58
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