ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD

摘要

A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.