METHODS OF FORMING SEMICONDUCTOR MODULES AND SEMICONDUCTOR MODULES FORMED OF THE SAME

摘要

PURPOSE: A method for forming a semiconductor module and the semiconductor module made by the same are provided to implement a small light semiconductor module by directly bonding a semiconductor chip to a flexible panel. CONSTITUTION: A polymer material layer with high adhesion is formed on a support substrate(S10). A plurality of semiconductor chips are bonded to the support substrate using the polymer material layer(S20). The plurality of semiconductor chips are separated by cutting the support substrate(S30). The semiconductor chip attached to the support substrate is bonded to the flexible panel(S40). The support substrate is removed from the semiconductor chip(S50). [Reference numerals] (S10) Forming a polymer material layer on a support substrate; (S20) Bonding a plurality of semiconductor chips to the support substrate using the polymer material layer; (S30) Separating the plurality of semiconductor chips by cutting the support substrate; (S40) Bonding the separated semiconductor chip on a flexible panel; (S50) Removing the support substrate from the bonded semiconductor chip