WIRE BONDING JOINT STRUCTURE OF JOINT PAD, AND METHOD FOR PREPARING THE SAME

摘要

PURPOSE: A wire bonding coupling structure body of a connection terminal and a manufacturing method thereof are provided to improve following between a bonding pad and a Au wire by reducing the intensity of a wire bonding pad. CONSTITUTION: A non-electrolytic surface process plating layer(130) of a connection terminal consisting of a nickel layer/palladium layer/gold layers(131,132,133) is connected to a metal wire. The metal wire is combined with the non-electrolytic surface process plating layer. The depth of the wire bonding pad formed through wedge deformation is 1.0 micrometer or greater. The thickness of the nickel layer in the non-electrolytic surface process plating layer is 1 micrometer or less.