发明名称 LIGAND IMMOBILIZATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate to which ligands are highly densely connected, even when a conventional ligand immobilization method is applied to a substrate whose one surface comprises SiN, Ta<SB POS="POST">2</SB>O<SB POS="POST">5</SB>, Nb<SB POS="POST">2</SB>O<SB POS="POST">5</SB>, HfO<SB POS="POST">2</SB>, ZrO<SB POS="POST">2</SB>or ITO, a ligand immobilization substrate obtained by the manufacturing method, and an intermolecular interaction detecting method using the substrate. <P>SOLUTION: The manufacturing method for ligand immobilization substrates includes a step for immobilizing ligands in a liquid phase on the surface of a substrate comprising at least one type selected from a group comprising SiN, Ta<SB POS="POST">2</SB>O<SB POS="POST">5</SB>, Nb<SB POS="POST">2</SB>O<SB POS="POST">5</SB>, HfO<SB POS="POST">2</SB>, ZrO<SB POS="POST">2</SB>and ITO. The manufacturing method is characterized in that a surfactant contained in the liquid phase is not less than 0 mass% and less than 0.001 mass%. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013011464(A) 申请公布日期 2013.01.17
申请号 JP20110143126 申请日期 2011.06.28
申请人 KONICA MINOLTA ADVANCED LAYERS INC 发明人 KURIHARA YOSHIKAZU
分类号 G01N33/543;G01J3/45;G01N21/05;G01N21/45;G01N21/64 主分类号 G01N33/543
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