| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for interposers which are not apt to crack or chip even when a thin glass substrate is used. <P>SOLUTION: The method of manufacturing the substrate for interposers includes the processes of: (a) preparing a glass substrate which has a first and a second surface; (b) arranging a first fixed member on the first surface side of the glass substrate and a second fixed member on the second surface side, the first fixed member having a first contact part which comes into contact with the first surface of the glass substrate and a first non-contact part which does not come into contact with the first surface of the glass substrate and the second fixed member having a second contact part which comes into contact with the second surface of the glass substrate and a second non-contact part which does not come into contact with the second surface of the glass substrate; and (c) irradiating the glass substrate with laser light to form at least one through hole in the glass substrate by passing it through the first and second non-contact parts. <P>COPYRIGHT: (C)2013,JPO&INPIT |
