| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor chip which is not likely to damage the semiconductor chip in a face up mounting method and achieves low costs. <P>SOLUTION: In a mounting method of a semiconductor chip, the semiconductor chip 20, including a main flat surface 20A and a rear surface 20B, is mounted on a substrate 10. The mounting method of the semiconductor chip includes: a chip side bump formation step where chip side bumps 41 are formed on the main flat surface 20A of the semiconductor chip 20; a pick up step where the semiconductor chip 20 is picked up while the chip side bumps 41 are being placed in contact with an attraction surface 61 of pick up means 60; a placement step where the semiconductor chip 20 is placed on a predetermined position of the substrate 10 so that the rear surface 20B faces the substrate 10; and a fixation step where the semiconductor chip 20 is fixed to the substrate 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
