ADHESION MEMBER FOR SEMICONDUCTOR, DICING/DIE BONDING INTEGRAL TYPE ADHESION MEMBER USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesion member for a semiconductor which is excellent in a wire bonding property and unevenness followability, and can support a wafer of an overhang part after lamination, a dicing/die bonding integral type adhesion member using the same, and a method for manufacturing a semiconductor device.

SOLUTION: The adhesion member includes an adhesive layer and a base material layer, wherein the adhesive layer contains a thermosetting resin including (A) a high-molecular weight component having a crosslinkable functional group, a weight-average molecular weight of 100,000-1,000,000, and a glass transition temperature of -50 to 50°C, (B) a polyfunctional epoxy resin having a weight-average molecular weight of 500 or more and (C) a phenol resin, and (D) inorganic fine particles, and the thickness of the adhesive layer is 2-7 μm.

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