发明名称 RESIN COMPOSITION USED FOR FILM FOR PRINTED CIRCUIT BOARD, AND ITS USE
摘要 PROBLEM TO BE SOLVED: To display a superior bending resistance while keeping the transmission characteristics of electric signals good in a high frequency band. SOLUTION: The resin composition used for printed wiring boards contains a component (a) of 80-99.5 mass%, and a component (b) of 0.5-20 mass%. The component (a) is a graft copolymer of an aromatic vinyl monomer of 15-40 parts by weight graft-polymerized with a random or block copolymer of 60-85 parts by weight composed of monomer units of a nonpolarα-olefin monomer, etc., and the component (b) is a graft copolymer of an aromatic vinyl monomer of 5-30 parts by weight graft-copolymerized with a random or block copolymer of 70-95 parts by weight composed of monomer units of a nonpolarα-olefin monomer, etc. of 60-90 mass% and an aromatic vinyl monomer units of 10-40 mass%. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324236(A) 申请公布日期 2007.12.13
申请号 JP20060150528 申请日期 2006.05.30
申请人 NOF CORP 发明人 OTA TOSHIHIRO;SONODA KENSAKU;YAMADA TOMIO
分类号 H05K1/03 主分类号 H05K1/03
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