APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME

摘要

According to the present invention, an apparatus for filling a wafer via with a solder and having a pressure unit comprises: a solder bath which contains molten solder therein, which has an accommodation space with an open top, and which has an outlet portion formed at one side thereof in order to discharge air from the accommodation space; a fixing unit which fixes a wafer having a via formed on one surface thereof in said accommodation space so as to seal the accommodation space; and a pressure unit which presses the molten solder contained in the solder bath from the bottom so as to cause the molten solder to flow upwardly such that the molten solder fills into the via. Further, when in an apparatus for filling a wafer having a through-via with solder, the fixing unit provides a suction force to an upper surface of the wafer and fixes the wafer in the accommodation space, and the pressure unit presses the molten solder contained in the solder bath from the bottom so as to cause the molten solder to flow upwardly such that the molten soldier fills the via with the aid of the suction force of the fixing unit.