发明名称 MOUNTING METHOD, MOUNTING DEVICE AND MOUNTING JIG
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting method, a mounting device, and a mounting jig, capable of effectively mounting a component parallel to a substrate while reducing the damage to the component. <P>SOLUTION: The mounting method includes a first step of pressing the component on a mounting surface of the substrate via a brazing material while holding the component at a position off a gravity center of the component and a second step of applying pushing force toward the mounting surface of the substrate to the position of the opposite side of the position held in the first step to the gravity center of the component after the first step. The mounting device has a holding member for holding the position displaced from the gravity of the component and an auxiliary member for applying pushing force to the position of the opposite side of the position held by the holding member to the gravity of the component and the auxiliary member applies the pushing force to the component toward the mounting surface after the holding member pushing the component to the mounting surface of the substrate via the brazing material while holding the component. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013010156(A) 申请公布日期 2013.01.17
申请号 JP20110143471 申请日期 2011.06.28
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TATEIWA YOSHIHIRO
分类号 B25B27/14;B25B9/02 主分类号 B25B27/14
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