| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem in producing a conventional white member covering type LED light-emitting device: A translucent member or a phosphor layer is bonded to a light-emitting surface after an LED side face side is filled with a white member under such a state that the light-emitting surface of the LED mounted on a circuit board is exposed and the white member is hardened; therefore, adhesion of coating material to a light extraction surface of the LED may occur and hence an extra process, such as polishing removal, may be required. <P>SOLUTION: The light-emitting device comprises: a phosphor plate that is bonded to a light-emitting element and a light-emitting surface of the light-emitting element with transparent adhesive, and that is larger than the light-emitting surface of the light-emitting element; a circuit board with the light-emitting element subjected to flip-chip mounting; a first white member with which the side face of the light-emitting element and the bottom face of the phosphor plate are filled; and a second white member charged between the bottom face of the light-emitting element and the circuit board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
