| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device package having a small sized and an integrated structure by integrating a rectification circuit and other driving circuits provided to drive light emitting devices in an inner portion of a semiconductor substrate. <P>SOLUTION: A semiconductor light emitting device package of the present invention comprises: a semiconductor substrate having a first principal surface and a second principal surface opposed thereto; a light source disposed on a first principal surface side of the semiconductor substrate; a plurality of electrode pads disposed on a second principal surface side of the semiconductor substrate; a conductive via extended from the plurality of electrode pads and penetrating the semiconductor substrate from the second principal surface thereof to the first principal surface thereof; and a driving circuit unit including a plurality of diodes obtained through a pn junction formed by a p-type region having a relatively high concentration of a p-type impurity and an n-type region having a relatively high concentration of an n-type impurity inside the semiconductor substrate, the driving circuit unit being electrically connected to the conductive via and the light source, thereby rectifying an alternating current applied through the plurality of electrode pads and supplying the rectified current to the light source. <P>COPYRIGHT: (C)2013,JPO&INPIT |
