| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem of a conventional electronic apparatus and a manufacturing method of the conventional apparatus that a resin, used for a wiring layer on the solder ball side, is limited and thus the cost reduction of the electronic apparatus is inhibited. <P>SOLUTION: An electronic apparatus 1 includes a wiring layer 10 (first wiring layer) and a wiring layer 20 (second wiring layer). The wiring layer 20 is formed on a lower surface of the wiring layer 10. The wiring layer 20 has an area larger than the wiring layer 10 in a plain view and extends to the outer side of the wiring layer 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
