| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead wire connection device in which lead wires for connecting a plurality of crystal semiconductor cells used for a solar cell module can be cleaned. <P>SOLUTION: A semiconductor cell lead wire connection device includes: tape bonding means for bonding an adhesive conductive tape onto upper and lower surfaces of semiconductor cells from a feeding part; conveying means for pitch feeding the semiconductor cells with the conductive tape bonded thereon; lead wire processing means 15a to 15d for mold-processing a lead wire 2; cleaning means 111 for removing dirt adhered to the lead wire before the lead wire is mold-processed by the lead wire processing means; temporal press-bonding means provided on a portion facing the semiconductor cells to be pitch-fed and, while retaining the lead wire having been molded, alternately connects the upper and lower surfaces of the semiconductor cells arranged side by side to the conductive tape provided on the upper and lower surfaces of the semiconductor cells to be pitch-fed, by repeating temporal press-bonding; and regular press-bonding means provided on the downstream side in the feeding direction of the semiconductor cells relative to the temporal press-bonding means, for performing regular press-bonding on a pair of upper and lower lead wires temporarily press-bonded on the upper and lower surfaces of the semiconductor cells. <P>COPYRIGHT: (C)2013,JPO&INPIT |
