| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid state imaging device in which a transparent conductive film for the solid state imaging device especially suitable for a wafer level imaging module is disposed at a predetermined position, and to provide the transparent conductive film manufactured using the method, and the solid state imaging device having the transparent conductive film. <P>SOLUTION: Disclosed is a method for manufacturing a solid state imaging device having a transparent conductive film on the surface of an internal member. In the solid state imaging device, the transparent conductive film containing at least one of conductive metal particles, a conductive metal nanowire, conductive oxide particles and a conductive polymer is disposed in the internal member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
