METHOD FOR BONDING POLYACETAL RESIN MOLDING

摘要

PROBLEM TO BE SOLVED: To develop an excellent adhesivity in bonding a polyacetal resin molding to an adherend with an adhesive.

SOLUTION: The method comprises a surface treatment step of irradiating target 4 with a pulse laser L1 to generate vacuum-ultraviolet light L2 and to scatter scattering particles 20 from the target 4 and to attach the scattering particles 20 to a surface 10a of polyacetal resin molding 10 while irradiating the surface 10a with the vacuum-ultraviolet light L2; and a bonding step of coating an organic adhesive on the scattering particle-attached surface of the polyacetal resin molding and bonding the polyacetal resin molding to an adherend with the adhesive. In the surface treatment step, the crystallinity of the polyacetal resin molding surface 10a is lowered as compared to that before going through the surface treatment step.

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