发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern.
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申请公布号 |
US2013015544(A1) |
申请公布日期 |
2013.01.17 |
申请号 |
US201113238622 |
申请日期 |
2011.09.21 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;HAN MYEONG WOO;YOO DO JAE;LEE JUNG AUN;YOON JUNG HO;PARK CHUL GYUN |
发明人 |
HAN MYEONG WOO;YOO DO JAE;LEE JUNG AUN;YOON JUNG HO;PARK CHUL GYUN |
分类号 |
H01L31/0203;H01L31/18;H01L33/52 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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