| 摘要 |
<p>In a breaking operation, a substrate (50) is moved so that a blade (23) can be situated in line with a scribe line (54), and the blade is lowered to break the substrate (50). After the breaking, the blade (23) is raised. Then, the substrate (50) is moved along its surface while taking an image of the substrate by using a camera (35) after the breaking. Moreover, the blade (23) is lowered to break the substrate (50). After the breaking, the blade (23) is raised. Then, the substrate is moved along its surface while performing image processing concurrently. After the movement of the substrate (50), the position of the substrate is corrected so that the following scribe line (54) to be cut for breaking can be situated immediately below the blade (23). In this way, the time required for breaking the substrate formed with a multiplicity of scribe lines (54) into pieces can be shortened.</p> |
